This means we need an advance in the actual optical component and thermal management used to deliver the needed increase in bandwidth in a power efficient manner. So where do we go from here?įirst lets look at the 3 available dimensions at our disposal for scaling up the interface bandwidth. With higher bandwidth switching ASICs on the near horizon the industry clearly needs a higher ethernet interface speed and new form factors to address the physical real estate restrictions. The QSFP28 (Quad-SFP) form factor currently occupies the entire front panel real estate of a 1RU switch at 32x100G QSFP28 ports prompting switching vendors to release 2RU platforms in order to cram 64x100G ports and fully drive the newest switching ASICs. Looking back at the last few years it certainly appears that ethernet switching ASICs and front panel interface bandwidth are clearly moving at a different pace in that a faster switching ASIC comes just ahead of the required ethernet interface speed and optic form factor size required to drive the full bandwidth the ASIC actually provides while still fitting into a 1RU top-of-rack ethernet switch or line card profile.Ĭurrent 6.4+ Tbps system on-a-chip (SOC) ASIC based switching solutions have moved past the available front panel interface bandwith inside of a single rack unit (RU).
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